• A wide range of applications is possible due to good adhesion (chemical linkage) to many different substrates, from low-cost polymers (e.g. FR4) to metals, oxidic and ceramic surfaces (e.g. special steel, aluminum, copper, SiO₂, glass, Al₂O₃ ceramics), and semiconductor substrates (e.g. silicon)
• Availability of many different application methods (e.g. spin, dip or spray coating, curtain coating, screen and pad printing)
• Easy modification of physical properties (e.g. viscosity: low for gaps/holes, or high, i.e. thick, for higher layer thicknesses)
• Low water absorption and water vapor permeation
• Good chemical resistance, even against strong acids and weak alkaline solutions, as well as organic substances
• SMD-friendly processing conditions (e.g. low curing temperature, < 170 °C, approx. 80 °C with hardeners, solderable up to approx. 300 °C)

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