ORMOCER®s as
dielectrics for
interconnection
technology
Contact:
Dr. Michael Popall Phone +49 931 4100-522 Fax +49 931 4100-559 michael.popall@ isc.fraunhofer.de
Fraunhofer-Institut für Silicatforschung ISC Neunerplatz 2 97082 Würzburg
The many different technologies available for structuring and the excellent adhesion of ORMOCER®s on various materials (e.g. silicon, SiO2, glass, metals, oxidic and low-cost polymer substrates such as BT and FR4) show that ORMOCER®s are perfectly suitable for applications in microelectronics and microsystem technology.
Their compatibility with traditional thin-film technology, simple means of processing (curing temperatures < 170 °C in standard atmosphere) and the possibility of creating microstructures (e.g. bumps and vias) guarantee maximum flexibility and versatility with respect to locally available technologies, with ORMOCER®s featuring negative resist behavior.
